N-Type M12 Monocrystalline Silicon Wafer Specification

N-Type M12 Monocrystalline Silicon Wafer Specification

The N-Type M12 Monocrystalline Silicon Wafer adopts a large pseudo square 210×210 mm format (φ295 mm diameter), increasing the active area and boosting power output for high-efficiency PV modules. Grown using the CZ method and doped with phosphorus, it features a <100> surface orientation, low dislocation density (≤500 cm⁻²), and N-type conductivity. With a resistivity range of 1.0–7.0 Ω·cm and minority carrier lifetime ≥1000 µs, it is ideal for advanced solar cell technologies such as TOPCon and HJT. The M12 wafer's optimized geometry and surface quality ensure excellent performance in next-generation high-power modules.
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Description
Technical Parameters

 

CZ silicon crystal growth

Czochralski (CZ) Process for Monocrystalline Silicon Production

 

Crafted with premium Czochralski growth and phosphorus doping, N-Type M12 monocrystalline silicon wafer comes in 210×210mm large pseudo square size to expand light-receiving area and upgrade module power generation efficiency. It boasts low dislocation density, stable resistivity and ultra-long minority carrier lifetime, paired with precise dimensional accuracy and superior surface finish. Fully adaptable to HJT, TOPCon and other advanced cell processes, it is an ideal base material for manufacturing high-efficiency and high-power photovoltaic modules.

Core Features & Application Advantages

 

The N-Type M12 Monocrystalline Silicon Wafer adopts a large pseudo square 210×210 mm format (φ295 mm diameter), increasing the active area and boosting power output for high-efficiency PV modules. Grown using the CZ method and doped with phosphorus, it features a <100> surface orientation, low dislocation density (≤500 cm⁻²), and N-type conductivity. With a resistivity range of 1.0–7.0 Ω·cm and minority carrier lifetime ≥1000 µs, it is ideal for advanced solar cell technologies such as TOPCon and HJT. The M12 wafer's optimized geometry and surface quality ensure excellent performance in next-generation high-power modules.

n-type-full-square-monocrystalline-solar47199107070 1

 

N-Type M12 Monocrystalline Silicon Wafer Specification1

 

 

Material properties

 

 

Property Specification Inspection Method
Growth method CZ  
Crystallinity Monocrystalline Preferential Etch Techniques(ASTM F47-88)
Conductivity type N-type Napson EC-80TPN
Dopant Phosphorus -
Oxygen concentration[Oi] ≦8E+17 at/cm3 FTIR (ASTM F121-83)
Carbon concentration[Cs] ≦5E+16 at/cm3 FTIR (ASTM F123-91)
Etch pit density(dislocation density) ≦500 cm-2 Preferential Etch Techniques(ASTM F47-88)
Surface orientation <100>±3° X-ray Diffraction Method (ASTM F26-1987)
Orientation of pseudo square sides <010>,<001>±3° X-ray Diffraction Method (ASTM F26-1987)

 

 

Electrical properties

 

Property Specification Inspection Method
Resistivity 1.0-7.0 Ω.cm Wafer inspection system
MCLT (minority carrier lifetime) ≥1000 µs Sinton BCT-400Transient(with injection level: 5E14 cm-3)

 

 

Geometry

 

 

Property Specification Inspection Method
Geometry pseudo square  
Bevel edge shape round  
Wafer Side length 210±0.25 mm wafer inspection system
Wafer Diameter φ295±0.25 mm wafer inspection system
Angle between adjacent sides 90° ± 0.2° wafer inspection system
Thickness 180 ﹢ 20/﹣10 µm175﹢ 20/﹣10 µm170﹢ 20/﹣10 µm165﹢ 20/﹣10 µm160﹢ 20/﹣10 µm150﹢ 10/﹣10 µm wafer inspection system
TTV (Total thickness variation) ≤ 27 µm wafer inspection system

 

 

 

Surface properties

 

Property Specification Inspection Method
Cutting method DW --
Surface quality as cut and cleaned, no visible contamination, (oil or grease, finger prints, soap stains, slurry stains, epoxy/glue stains are not allowed) wafer inspection system
Saw marks / steps ≤ 15µm wafer inspection system
Bow ≤ 40 µm wafer inspection system
Warp ≤ 40 µm wafer inspection system
Chip depth ≤0.3mm and length ≤ 0.5mm Max 2/pcs; no V-chip Naked eyes or wafer inspection system
Micro cracks / holes Not allowed wafer inspection system

 

 

 

 

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