In 2019, M12 (210mm x 210mm) p-Type mono wafers (295mm diameter silicon ingot) was lauched. The 6" format M2 (156.75mm x 156.75mm) is expected to be placed by M12 and M6.
1Material properties
|
Property |
Specification |
Inspection Method |
|
Growth method |
CZ |
|
|
Crystallinity |
Monocrystalline |
Preferential Etch Techniques(ASTM F47-88) |
|
Conductivity type |
P-type |
Napson EC-80TPN P/N |
|
Dopant |
Boron, Gallium |
- |
|
Oxygen concentration[Oi] |
≦8E+17 at/cm3 |
FTIR (ASTM F121-83) |
|
Carbon concentration[Cs] |
≦5E+16 at/cm3 |
FTIR (ASTM F123-91) |
|
Etch pit density(dislocation density) |
≦500 cm-3 |
Preferential Etch Techniques(ASTM F47-88) |
|
Surface orientation |
<100>±3° |
X-ray Diffraction Method (ASTM F26-1987) |
|
Orientation of pseudo square sides |
<010>,<001>±3° |
X-ray Diffraction Method (ASTM F26-1987) |
2Electrical properties
|
Property |
Specification |
Inspection Method |
|
Resistivity |
0.5-1.5 Ωcm |
Wafer inspection system |
|
MCLT (minority carrier lifetime) |
≧50 μs |
Sinton BCT-400 (with injection level: 1E15 cm-3) |
3Geometry
|
Property |
Specification |
Inspection Method |
|
Geometry |
Full square |
|
|
Wafer Side length |
210±0.25 mm |
wafer inspection system |
|
Wafer Diameter |
φ295±0.25 mm |
wafer inspection system |
|
Angle between adjacent sides |
90° ± 0.2° |
wafer inspection system |
|
Thickness |
180 ﹢ 20/﹣10 µm; 170﹢ 20/﹣10 µm |
wafer inspection system |
|
TTV (Total thickness variation) |
≤ 27 µm |
wafer inspection system |
4Surface properties
|
Property |
Specification |
Inspection Method |
|
Cutting method |
DW |
-- |
|
Surface quality |
as cut and cleaned, no visible contamination, (oil or grease, finger prints, soap stains, slurry stains, epoxy/glue stains are not allowed) |
wafer inspection system |
|
Saw marks / steps |
≤ 15µm |
wafer inspection system |
|
Bow |
≤ 40 µm |
wafer inspection system |
|
Warp |
≤ 40 µm |
wafer inspection system |
|
Chip |
depth ≤0.3mm and length ≤ 0.5mm Max 2/pcs; no V-chip |
Naked eyes or wafer inspection system |
|
Micro cracks / holes |
Not allowed |
wafer inspection system |
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