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Tel:+86-571-56772661
Fax:+86-571-56772663
Office:Room 411, Tower 1, No.19 Xintang Road, Jianggan District, Hangzhou, China
E-mail:info@dsneg.com

4 Inch (100mm) Wafer

Microelectronics’ product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. ● 4"P type, Polished silicon wafer (25 pcs) ● Orientation: 100 ● Resistivity: 0.1 - 40 Ohm•cm (It may vary from batch to batch) ● Thickness: 525+/-20um ●Prime/Monitor/Test Grade
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【Product introduction】

4 inch(100mm) Polished Wafer DSC01065 730


4 inch(100mm) Polished Wafer DSC01070 730


MATERIAL PROPERTIES

Parameter

Characteristic

ASTM Control Method

Type/Dopant

P, Boron N, Phosphorous N, Antimony N, Arsenic

F42

Orientations

<100>, <111> slice off orientations per   customer's specifications

F26

Oxygen Content

1018 ppmA Custom tolerances per customer's   specification

F121

Carbon Content

< 0.5 ppmA Custom tolerances per customer's   specification

F123

Resistivity ranges- P, Boron- N, Phosphorous- N,   Antimony- N, Arsenic

0.001 - 50 ohm·cm
  0.1 - 40 ohm·cm
  0.005 - 0.025 ohm·cm
  < 0.005 ohm cm

F84

 

MECHANICAL PROPERTIES

Parameter

Prime

Monitor/ Test A

Test

ASTM Method

Diameter

100 ± 0.2 mm

100 ± 0.2 mm

100 ± 0.5 mm

F613

Thickness

525 ± 20 µm (standard)

525 ± 25 µm (standard) 381 ± 25 µm 625 ± 25 µm 700 ± 25   µm 800 ± 25 µm 1000 ± 25 µm 1500 ± 25 µm

525 ± 50 µm (standard)

F533

TTV

< 5 µm

< 10 µm

< 15 µm

F657

Bow

< 30 µm

< 30 µm

< 40 µm

F657

Wrap

< 30 µm

< 30 µm

< 40 µm

F657

Edge Rounding

SEMI-STD

F928

Marking

SEMI-STD Flats, Primary SEMI-Flat only

F26, F671

  

SURFACE QUALITY

Parameter

Prime

Monitor/ Test A

Test

ASTM Method

Front Side Criteria

Surface condition

Chemical Mechanical Polished

Chemical Mechanical Polished

Chemical Mechanical Polished

F523

Surface Roughness

< 2 A°

< 2 A°

< 2 A°


Contamination,Particles @ >0.3 µm

= 20

= 20

= 30

F523

Haze, Pits, Orange peel

None

None

None

F523

Saw Marks, striations

None

None

None

F523

Back Side Criteria

Cracks, crowsfeet, saw marks,stains

None

None

None

F523

Surface condition

Caustic etched

F523

  

Product description

Microelectronics’ product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required.

 

We also offer rectangular and square wafer pieces. Basically realisable range of the edge lengths for silicon wafers is 5 x 5 mm2 ... 100 x 120 mm2 etc. The cost / wafer piece depends on the material as well as on the number of wafer pieces required.

 

Customized dicing and polishing is also avaible according to your requirements. Please feel free to contact us.

 

Product features

·         4" P/N type, Polished silicon wafer (25 pcs)

·         Orientation: 100

·         Resistivity: 0.1 - 40 Ohm·cm (It may vary from batch to batch)

·         Thickness: 525+/-20um

·         Prime/Monitor/Test Grade


Hot Tags: 4 inch (100mm) wafer, China, suppliers, manufacturers, factory, made in China
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  • Contact Us

    Tel:+86-571-56772661
    Fax:+86-571-56772663
    Office:Room 411, Tower 1, No.19 Xintang Road, Jianggan District, Hangzhou, China
    E-mail:info@dsneg.com

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